Continuous loop cooling for an electronic device

Bret P. Elison; Phillip V. Mann; Arden L. Moore; Arvind K. Sinha

Continuous loop cooling for an electronic device

Bret P. Elison
, Phillip V. Mann
, Arden L. Moore
, Arvind K. Sinha

IBM

Research output: Other contribution

Original language	American English
State	Published - Dec 4 2013
Externally published	Yes

Disciplines

Navigation, Guidance, Control and Dynamics
Materials Science and Engineering
Engineering

Cite this

@misc{cc8c64c884a44fb0940e069005431ed5,

title = "Continuous loop cooling for an electronic device",

author = "Elison, \{Bret P.\} and Mann, \{Phillip V.\} and Moore, \{Arden L.\} and Sinha, \{Arvind K.\}",

note = "A continuous loop of thermally conductive material is provided with a first portion in frictional contact with a casing of an electronic device and a second portion located within a cooling region. The loop is advanced such that the first portion is located within the cooling region and the second portion is in frictional contact with the casing.",

year = "2013",

month = dec,

day = "4",

language = "American English",

type = "Other",

}

TY - GEN

T1 - Continuous loop cooling for an electronic device

AU - Elison, Bret P.

AU - Mann, Phillip V.

AU - Moore, Arden L.

AU - Sinha, Arvind K.

N1 - A continuous loop of thermally conductive material is provided with a first portion in frictional contact with a casing of an electronic device and a second portion located within a cooling region. The loop is advanced such that the first portion is located within the cooling region and the second portion is in frictional contact with the casing.

PY - 2013/12/4

Y1 - 2013/12/4

UR - https://patents.google.com/patent/US9265179

M3 - Other contribution

ER -

Continuous loop cooling for an electronic device

Disciplines

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