@article{1d646c1eb5514a6799c00d6bb86bec87,
title = "Copper Plated Microchannel Heat Exchanger for MEMS Application",
author = "E. Borquist and E. Ogbonnaya and S. Thapa and D. Wood and L. Weiss",
note = "Demand for increased density circuit architecture, micro- and nano-scale devices, and the overall down-scaling of system components has driven research into understanding transport phenomena at reduced scales. One method to enhance transport processes is the utilization of mini-, micro-, or nano-channels which drive uniform temperature and velocity profiles throughout the system.",
year = "2014",
month = aug,
day = "3",
doi = "10.1115/ICNMM2014-21927",
language = "American English",
journal = "ASME 2014 12th International Conference on Nanochannels, Microchannels, and Minichannels collocated with the ASME 2014 4th Joint US-European Fluids Engineering Division Summer Meeting",
}