Features of surface micromachining and wafer bonding process

S. K. Bag; Daniela S. Mainardi; N. P. Mahalik

doi:10.1007/3-540-29339-6_6

Features of surface micromachining and wafer bonding process

S. K. Bag
, Daniela S. Mainardi
, N. P. Mahalik

Vellore Institute of Technology
Institute for Micromanufacturing
Gwangju Institute of Science and Technology

Research output: Chapter in Book/Report/Conference proceeding › Chapter

Original language	English
Title of host publication	Micromanufacturing and Nanotechnology
Publisher	Springer Berlin Heidelberg
Pages	107-130
Number of pages	24
ISBN (Print)	3540253777, 9783540253778
DOIs	https://doi.org/10.1007/3-540-29339-6_6
State	Published - 2006
Externally published	Yes

UN SDGs

This output contributes to the following UN Sustainable Development Goals (SDGs)

SDG 9 Industry, Innovation, and Infrastructure

ASJC Scopus Subject Areas

General Materials Science
General Chemistry

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10.1007/3-540-29339-6_6

Cite this

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title = "Features of surface micromachining and wafer bonding process",

author = "Bag, \{S. K.\} and Mainardi, \{Daniela S.\} and Mahalik, \{N. P.\}",

year = "2006",

doi = "10.1007/3-540-29339-6\_6",

language = "English",

isbn = "3540253777",

pages = "107--130",

booktitle = "Micromanufacturing and Nanotechnology",

publisher = "Springer Berlin Heidelberg",

}

TY - CHAP

T1 - Features of surface micromachining and wafer bonding process

AU - Bag, S. K.

AU - Mainardi, Daniela S.

AU - Mahalik, N. P.

PY - 2006

Y1 - 2006

UR - https://www.scopus.com/pages/publications/84891966860

UR - https://www.scopus.com/pages/publications/84891966860#tab=citedBy

U2 - 10.1007/3-540-29339-6_6

DO - 10.1007/3-540-29339-6_6

M3 - Chapter

AN - SCOPUS:84891966860

SN - 3540253777

SN - 9783540253778

SP - 107

EP - 130

BT - Micromanufacturing and Nanotechnology

PB - Springer Berlin Heidelberg

ER -

Features of surface micromachining and wafer bonding process

UN SDGs

ASJC Scopus Subject Areas

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