Micro channel heat sink with embedded pin-fin structures

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Original language	English
Title of host publication	10th AIAA/ASME Joint Thermophysics and Heat Transfer Conference
State	Published - 2010
Event	10th AIAA/ASME Joint Thermophysics and Heat Transfer Conference - Chicago, IL, United States Duration: Jun 28 2010 → Jul 1 2010

Series	10th AIAA/ASME Joint Thermophysics and Heat Transfer Conference

Conference	10th AIAA/ASME Joint Thermophysics and Heat Transfer Conference
Country/Territory	United States
City	Chicago, IL
Period	6/28/10 → 7/1/10

ASJC Scopus Subject Areas

@inproceedings{3b06bc10ea2d4e20b575bdaae8fe7fd1,

title = "Micro channel heat sink with embedded pin-fin structures",

author = "John, \{T. J.\} and B. Mathew and H. Hegab",

year = "2010",

language = "English",

isbn = "9781600867453",

series = "10th AIAA/ASME Joint Thermophysics and Heat Transfer Conference",

booktitle = "10th AIAA/ASME Joint Thermophysics and Heat Transfer Conference",

note = "10th AIAA/ASME Joint Thermophysics and Heat Transfer Conference ; Conference date: 28-06-2010 Through 01-07-2010",

}

TY - GEN

T1 - Micro channel heat sink with embedded pin-fin structures

AU - John, T. J.

AU - Mathew, B.

AU - Hegab, H.

PY - 2010

Y1 - 2010

UR - https://www.scopus.com/pages/publications/78649565642

UR - https://www.scopus.com/pages/publications/78649565642#tab=citedBy

M3 - Conference contribution

AN - SCOPUS:78649565642

SN - 9781600867453

T3 - 10th AIAA/ASME Joint Thermophysics and Heat Transfer Conference

BT - 10th AIAA/ASME Joint Thermophysics and Heat Transfer Conference

T2 - 10th AIAA/ASME Joint Thermophysics and Heat Transfer Conference

Y2 - 28 June 2010 through 1 July 2010

ER -